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1x66

Teridian's 73M1x66B devices bring to FXO applications Teridian's experience and knowledge of DAA technology. Available as a two chip set or as the world's first single package the 73M1x66B offers a solution that can be used globally with a single BOM that meets worldwide homologation requirements ideal for Broadband Media gateways or IADs intended for global use. The 73M1x66B is a robust and reliable solution that is designed for operation in normal and extreme environments.

Features

Full FXO for VOIP and PCM applications
  • Integrated functionality supports the requirements of connecting VOIP appliances to the PSTN
  • Robust performance and compliant with G.711, G.703 and ANSI T1.403
Single package (73M1866B) or chip set (73M1966B) solutions available
  • Single package small form factor provides up to 4.5kV isolation
  • Chip set allows for support for over 4.5kV isolation (recommended for 6kV applications)
Integrated support for programmable DAA with a single BOM for worldwide homologation
  • Global DAA compliance with FCC, TBR-21, JATE and other PTT standards with one BOM
  • Choice of PSTN line termination and impedance matching circuits to meet global needs
  • Programmable PSTN line current control to match different country homologation requirements
Teridian's MicroDAA™ architecture using low cost pulse transformer
  • Best in class EMI and noise performance
  • Improved loop length performance by providing power to line side device over the isolation barrier
32-pin QFN and 20-pin TSSOP packages (73M1966B)
42-pin QFN package (73M1866B)

 

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