Skip to content

1x22

The 73M1x22 is a third generation silicon Direct Access Arrangement (DAA) that offers state of the art performance at a competitive price. Supporting Analog Front End (AFE) and DAA functionality, the 73M1x22 with a single BOM provides programmable compliance for global PTT homologation needs. The 73M1822 is the world’s first single package silicon DAA offering all the functionality of the 73M1x22 family in a small 8mm x 8mm QFN package that supports normal and extreme environments.

Features

Full Analog Front End (AFE) and DAA (Direct Access Arrangement) for voice-band modem applications
  • Integrated functionality supports the connection of voice-band modems and devices to the PSTN
Single package (73M1822) or chip set (73M1922) solutions available
  • Single package small form factor provides up to 4.5kV isolation
  • Chip set allows for support for over 4.5kV isolation (recommended for 6kV applications)
Integrated support for programmable DAA with a single BOM for worldwide homologation
  • Global DAA compliance with FCC, TBR-21, JATE and other PTT standards with one BOM
  • Choice of PSTN line termination and impedance matching circuits to meet global needs
  • Programmable PSTN line current control to match different country homologation requirements
Teridian's MicroDAA™ architecture using low cost pulse transformer
  • Best in class EMI and noise performance
  • Improved loop length performance by providing power to line side device over the isolation barrier
32-pin QFN and 20-pin TSSOP packages (73M1922)
42-pin QFN package (73M1822)

 

NDA REQUIRED TO ACCESS DETAILED PRODUCT INFORMATION